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triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 1 april 13, 2004 10.7gb/s linear optical modu lator driver TGA4819-EPU-SL oc-192 metro and long haul applications surface mount package key features and performance ?up to 10 v pp linear output voltage ? 20 db gain ? internal dc blocks ? integrated power detector ? single-ended input / output ? small form factor - 11.4 x 8.9 x 2 mm - 0.450 x 0.350 x 0.080 inches primary applications ? mach-zehnder linear modulator driver for metro and long haul. description the triquint TGA4819-EPU-SL is part of a series of optical driver amplifiers suitable for a variety of driver applications. the tga4819 is a medium power wideband agc amplifier that typically provides 20db small signal gain with 20db agc range. the tga4819 is an excellent choice for applications requiring high drive combined with high linearity. the tga4819 has demonstrated capability to deliver 10vpp while maintaining output harmonic levels near -30dbc for a 2ghz fundamental. the tga4819 requires a low frequency choke and control circuitry. note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. preliminary measured performance bias conditions: v d = 8v, v ctrl = +1v, i d = 310ma prbs 2 31 -1; 10.7gbps; vin = 1vpp; cpc = 50%
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 2 april 13, 2004 TGA4819-EPU-SL note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. table i maximum ratings symbol parameter value notes v d drain voltage 9 v 1/ 2 / v g gate voltage range -3v to 0v 1/ v ct rl control voltage range -3v to v d /2 1/ i d drain supply current (quiescent) 400 ma 1/ 2 / | i g | gate supply current 5 ma 1/ p in input continuous wave power 23 dbm 1/ 2 / v in 10.7gb/s prbs input voltage 4 v pp 1/ 2 / p d power dissipation 3.1 w 1/ 2 / 3 / t ch operating channel temperature 150 0 c4/ t m mounting temperature (10 seconds) 230 0 c t stg storage temperature -65 to 150 0 c 1/ these ratings represent the maximum operable values for this device 2/ combinations of supply voltage, supply current, input power, and output power shall not exceed p d at a package base temperature of 70 c 3/ when operated at this bias condition with a baseplate temperature of 70 c, the mttf is reduced to 1.0e+6 hours 4/ junction operating temperature will directly affect the device median time to failure (mttf). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. table ii thermal information parameter test conditions t ch ( c) r jc ( c/w) mttf (hrs) r jc thermal resistance (channel to backside of package) v d = 8.1v i d = 350ma p diss = 2.8w t base = 70 c 142.8 25.7 1.9e6 note: thermal transfer is conducted th rough the bottom of the TGA4819-EPU-SL package into the motherboard. th e motherboard must be designed to assure adequate thermal transfer to the base plate.
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 3 april 13, 2004 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. TGA4819-EPU-SL table iii rf characterization table (t a = 25 c, nominal) (v d = 8v, v ctrl = +1v, i d = 310ma 5% , v g -0.3v) parameter test conditions typ units notes small signal bandwidth 8 ghz small signal gain 100 mhz ? 4 ghz 6 ghz 10 ghz 14 ghz 20 19 17 12 db 1/ 2 / input return loss 100 mhz ? 14 ghz 15 db 1/ 2 / output return loss 100 mhz ? 14 ghz 13 db 1/ 2 / small signal agc range midband 20 db output power @ p 1db 2 ghz 25.5 dbm 3/ note: table iii lists the rf characteristics of typical devices as determined by fixtured measurements. 1/ verified at package level rf test 2/ package rf test bias: v d = 8v, v ct rl = +1v, adjust v g to achieve i d =310 ma 3/ verified at die level on-wafer probe
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 4 april 13, 2004 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v TGA4819-EPU-SL note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 101214161820 frequency (ghz) gain (db) -30 -25 -20 -15 -10 -5 0 0 2 4 6 8 101214161820 frequency (ghz) return loss (db) s11 s22
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 5 april 13, 2004 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v TGA4819-EPU-SL note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0123456789101112 vout (vamp) vref - vdet (v) 0 1 2 3 4 5 6 7 8 9 10 11 12 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vin (vpp) vout (vpp)
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 6 april 13, 2004 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v prbs 2 31 -1; 10.7gbps; cpc = 50% TGA4819-EPU-SL note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. vin = 500mv pp vin = 1v pp input signal vin = 1v pp includes 8ghz bessel filter
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 7 april 13, 2004 application circuit note: 1. c1 extend low frequency performance thru 30 khz. for applications requiring low frequency performance thru 100 khz, c1 may be omitted 2. c2 is a power supply decoupling capacitors and may be omitted when driven directly with an op-amp. note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. TGA4819-EPU-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 8 april 13, 2004 designator description manufacturer part number c1, c7 10uf capacitor mlc ceramic avx 0802yc106kat c2, c3, c4, c5 0.01 ufcapacitor mlc ceramic avx 0603yc103kat c6 10 uf capacitor tantalum avx taja106k016r l1 220 uh inductor belfuse s581-4000-14 l2 330 nh inductor panasonic coilcraft elj-far33mf2 0603ls-331xjb r1, r2 274 ? resistor panasonic erj-2rkf2740x recommended components: application circuit (continued) note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. TGA4819-EPU-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 9 april 13, 2004 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. bias on 1. disable the output of the ppg 2. set v d = 0v, v ctrl = 0v & v g = 0v 3. set v g = -1.5v 4. increase v d to 8v observing id - assure i d = 0ma 5. set v ctrl = +1v - i d should still be 0ma 6. make v g more positive until i d = 310ma. v g will be approximately -0.3v. 7. enable the output of the ppg. 8. output swing adjust : adjust v ctrl slightly positive to increase output swing or adjust v ctrl slightly negative to decrease the output swing. 9. crossover adjust : adjust v g slightly positive to push the crossover down or adjust v g slightly negative to push the crossover up. bias off 1. disable the output of the ppg 2. set v ctrl = 0v 3. set v d = 0v 4. set v g = 0v laboratory - bias on/off procedure vd=8v, cpc=50% TGA4819-EPU-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 10 april 13, 2004 mechanical drawing note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. TGA4819-EPU-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 11 april 13, 2004 assembly of a TGA4819-EPU-SL package onto a motherboard manual assembly for prototypes 1. clean the motherboard with acetone and rinse with alcohol and di water. allow the motherboard to fully dry. 2. using a standard sn63 solder paste, such as kester sn63 r-560, dispense solder paste dots of 5 to 15 mil in diameter to the motherboard. assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each solder paste area and the closest edge of the ground pad. 3. manually place a TGA4819-EPU-SL on the motherbo ard with correct orientation and good alignment. the alignment can be determined manually by centering the package on the motherboard. the rf traces (pin 1 and pin 10) are located along the center horizontal axis of the package. 4. reflow the assembly on a hot plate with the surface temperature of the plate near 230 o c for 5 to 6 seconds. 5. let the assembly completely cool down. this package has little or no tendency to self- align during the reflow . 6. clean the assembly with acetone and rinse with alcohol and di water. high volume assembly of the package the TGA4819-EPU-SL is a standard surface mount component compatible with standard high volume assembly processes using standard sn63 solder paste, such as kester r560. refer to kester r560 manufacture data sheet for recommended reflow profile, cleaning, and handling. dispense solder paste using standard solder printing techniques such as stencil solder printing. pick-and-place using a standard machine such as mrsi machine. perfor m solder reflow using a sikama reflow system. recommended solder stencil and motherboard interface layout are available upon request. caution: the tga4819-epu contains gaas mmic devices that are susceptible to damage from electrostatic discharge. proper precautions should be observed during handling, assembly and test. note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and pr ocess specifications. specifications are subject to change without notice. TGA4819-EPU-SL

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